Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F

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Solder Paste
Lead Free / RoHS
No Clean

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Description

Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F eutectic. Metal Content: 87% metal by weight. Particle Size: T3 (25-45 microns) Size: 5cc/15g syringe
Solder Paste
Lead Free / RoHS
No Clean
Syringe
Low Temprature

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